Surfaces, Interfaces, and Applications
- An-Feng Wang
An-Feng Wang
Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China
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- Hong-Ping Ma*
Hong-Ping Ma
Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China
Institute of Wide Bandgap Semiconductor Materials and Devices, Research Institute of Fudan University in Ningbo, Zhejiang 315327, China
*Email: [emailprotected]
More by Hong-Ping Ma
- Qi-Min Huang
Qi-Min Huang
Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China
More by Qi-Min Huang
- Lin Gu
Lin Gu
Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China
More by Lin Gu
- Yi Shen
Yi Shen
Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China
More by Yi Shen
- Chengxi Ding
Chengxi Ding
Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China
See AlsoExcited-State Energy Manipulation Enables Single-Layer White Light-Emitting Diodes to Simulate the Solar SpectrumHigh Aspect Ratio Silicon Nanohole Arrays via Electric-Field-Incorporated Metal-Assisted Chemical EtchingDependence of Film Porosity on the Adsorption and Removal of Organic Contaminants from the Surface of Optical ComponentsUltralow Powered 2D MoS2-Based Memristive Crossbar Array for Synaptic ApplicationsMore by Chengxi Ding
- Yang-Chao Liu
Yang-Chao Liu
Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China
More by Yang-Chao Liu
- Kun Xu
Kun Xu
Nanofabrication Facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, Jiangsu 215123, China
More by Kun Xu
- Li Zhucheng
Li Zhucheng
Nanofabrication Facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, Jiangsu 215123, China
More by Li Zhucheng
- Li Zhang*
Li Zhang
Nanofabrication Facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, Jiangsu 215123, China
*Email: [emailprotected]
More by Li Zhang
- Xiaodong ZHANG
Xiaodong ZHANG
Nanofabrication Facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, Jiangsu 215123, China
More by Xiaodong ZHANG
- Qing-Chun Zhang
Qing-Chun Zhang
Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China
Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China
Institute of Wide Bandgap Semiconductor Materials and Devices, Research Institute of Fudan University in Ningbo, Zhejiang 315327, China
More by Qing-Chun Zhang
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ACS Applied Materials & Interfaces
Cite this: ACS Appl. Mater. Interfaces 2025, XXXX, XXX, XXX-XXX
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https://pubs.acs.org/doi/10.1021/acsami.5c04203
Published April 28, 2025
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Abstract
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β-phase gallium oxide (β-Ga2O3)/aluminum nitride (AlN) heterojunctions hold significant potential for high-power and microwave device applications. In this study, we systematically investigated the properties of the β-Ga2O3/AlN heterostructure grown via metal–organic chemical vapor deposition (MOCVD). High-resolution X-ray diffraction (HRXRD) and Raman spectroscopy revealed the crystal structures and demonstrated the high-crystalline quality of both films. Atomic force microscopy (AFM) scans displayed a smooth β-Ga2O3 surface with a root-mean-square (RMS) roughness of 3.6 nm. Scanning electron microscopy (SEM) images showed a flat surface with distinct heterostructure boundaries. Elemental distributions across the interface were mapped by using energy-dispersive spectroscopy (EDS). X-ray photoelectron spectroscopy (XPS) analysis characterized the chemical components of the sample and confirmed a type-II band alignment in the heterojunction, which facilitates electron accumulation. Furthermore, the thermal conductivity of β-Ga2O3 was measured at 4.2 W/(m·K), and the thermal boundary conductivity at the β-Ga2O3/AlN interface was determined to be 118.6 MW/(m2·K) using the time-domain thermoreflectance (TDTR) method. Temperature-dependent electrical performance of the β-Ga2O3/AlN SBD, including a low turn-on voltage of 0.1 V, ideality factor of 4.22, modified Richardson constant of 48.5 A/cm2 K2, and high breakdown voltage of 1260 V, was obtained. All of these values are competitive among β-Ga2O3-based heterostructures. The findings highlight the excellent interface quality, superior heat dissipation capability, and decent SBD performance of the β-Ga2O3/AlN integration, offering a promising platform for developing β-Ga2O3-based power devices capable of operating at high temperatures.
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© 2025 American Chemical Society
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- Diodes
- Heterojunctions
- Heterostructures
- Schottky barrier
- Thin films
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ACS Applied Materials & Interfaces
Cite this: ACS Appl. Mater. Interfaces 2025, XXXX, XXX, XXX-XXX
Click to copy citationCitation copied!
Published April 28, 2025
Publication History
Received
Accepted
Revised
Published
online
© 2025 American Chemical Society
Request reuse permissions
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