Band Alignment, Thermal Transport Property, and Electrical Performance of High-Quality β-Ga2O3/AlN Schottky Barrier Diode Grown via MOCVD (2025)

    Surfaces, Interfaces, and Applications

    • An-Feng Wang

      An-Feng Wang

      Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China

      Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China

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    • Hong-Ping Ma*

      Hong-Ping Ma

      Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China

      Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China

      Institute of Wide Bandgap Semiconductor Materials and Devices, Research Institute of Fudan University in Ningbo, Zhejiang 315327, China

      *Email: [emailprotected]

      More by Hong-Ping Ma

    • Qi-Min Huang

      Qi-Min Huang

      Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China

      Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China

      More by Qi-Min Huang

    • Lin Gu

      Lin Gu

      Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China

      Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China

      More by Lin Gu

    • Yi Shen

      Yi Shen

      Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China

      Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China

      More by Yi Shen

    • Chengxi Ding

      Chengxi Ding

      More by Chengxi Ding

    • Yang-Chao Liu

      Yang-Chao Liu

      Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China

      Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China

      More by Yang-Chao Liu

    • Kun Xu

      Kun Xu

      Nanofabrication Facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, Jiangsu 215123, China

      More by Kun Xu

    • Li Zhucheng

      Li Zhucheng

      Nanofabrication Facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, Jiangsu 215123, China

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    • Li Zhang*

      Li Zhang

      Nanofabrication Facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, Jiangsu 215123, China

      *Email: [emailprotected]

      More by Li Zhang

    • Xiaodong ZHANG

      Xiaodong ZHANG

      Nanofabrication Facility, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, Jiangsu 215123, China

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    • Qing-Chun Zhang

      Qing-Chun Zhang

      Institute of Wide Bandgap Semiconductors and Future Lighting, Academy for Engineering & Technology, Fudan University, Shanghai 200433, China

      Shanghai Research Center for Silicon Carbide Power Devices Engineering & Technology, Fudan University, Shanghai 200433, China

      Institute of Wide Bandgap Semiconductor Materials and Devices, Research Institute of Fudan University in Ningbo, Zhejiang 315327, China

      More by Qing-Chun Zhang

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    ACS Applied Materials & Interfaces

    Cite this: ACS Appl. Mater. Interfaces 2025, XXXX, XXX, XXX-XXX

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    https://pubs.acs.org/doi/10.1021/acsami.5c04203

    Published April 28, 2025

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    Band Alignment, Thermal Transport Property, and Electrical Performance of High-Quality β-Ga2O3/AlN Schottky Barrier Diode Grown via MOCVD (4)

    β-phase gallium oxide (β-Ga2O3)/aluminum nitride (AlN) heterojunctions hold significant potential for high-power and microwave device applications. In this study, we systematically investigated the properties of the β-Ga2O3/AlN heterostructure grown via metal–organic chemical vapor deposition (MOCVD). High-resolution X-ray diffraction (HRXRD) and Raman spectroscopy revealed the crystal structures and demonstrated the high-crystalline quality of both films. Atomic force microscopy (AFM) scans displayed a smooth β-Ga2O3 surface with a root-mean-square (RMS) roughness of 3.6 nm. Scanning electron microscopy (SEM) images showed a flat surface with distinct heterostructure boundaries. Elemental distributions across the interface were mapped by using energy-dispersive spectroscopy (EDS). X-ray photoelectron spectroscopy (XPS) analysis characterized the chemical components of the sample and confirmed a type-II band alignment in the heterojunction, which facilitates electron accumulation. Furthermore, the thermal conductivity of β-Ga2O3 was measured at 4.2 W/(m·K), and the thermal boundary conductivity at the β-Ga2O3/AlN interface was determined to be 118.6 MW/(m2·K) using the time-domain thermoreflectance (TDTR) method. Temperature-dependent electrical performance of the β-Ga2O3/AlN SBD, including a low turn-on voltage of 0.1 V, ideality factor of 4.22, modified Richardson constant of 48.5 A/cm2 K2, and high breakdown voltage of 1260 V, was obtained. All of these values are competitive among β-Ga2O3-based heterostructures. The findings highlight the excellent interface quality, superior heat dissipation capability, and decent SBD performance of the β-Ga2O3/AlN integration, offering a promising platform for developing β-Ga2O3-based power devices capable of operating at high temperatures.

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    © 2025 American Chemical Society

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    • Diodes
    • Heterojunctions
    • Heterostructures
    • Schottky barrier
    • Thin films

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    ACS Applied Materials & Interfaces

    Cite this: ACS Appl. Mater. Interfaces 2025, XXXX, XXX, XXX-XXX

    Click to copy citationCitation copied!

    Published April 28, 2025

    Publication History

    • Received

    • Accepted

    • Revised

    • Published

      online

    © 2025 American Chemical Society

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